precision CNC cavities,parts & components (TC4,PEEK, 7075,ZrO2) for medical device (MRI,CT,PET) systems

we are a dedicated manufacturer of high-performance Palladium-Silver-Copper (PdAgCu) alloy probes, engineered to deliver the ultimate in reliability, precision, and longevity for your most critical testing applications.

Our manufacturing prowess allows us to consistently produce probes with a minimum diameter of just 0.03mm and maintain critical tolerances as tight as ±2µm. This capability sets us apart in a market that is constantly moving towards smaller and more complex geometries.

We have mastered the art of creating complex tip geometries, from mirror-finished "Crown" tips to multi-faceted shapes, ensuring optimal contact force and minimizing damage to delicate chip pads.

Our expertise is rooted in a deep understanding of materials science. While traditional Beryllium Copper (BeCu) probes have served the industry for years, PdAgCu represents a significant leap forward. This advanced alloy offers a unique combination of properties that address the most demanding requirements of modern semiconductor testing.

parameters of PdAgCu Probes needles pins

PdAgCu alloys achieve a remarkable hardness of up to 460-480 HV after heat treatment. This exceptional strength prevents probe deformation and tip wear, even under the high overdrive forces required for advanced nodes. This directly translates to a significantly longer probe lifespan and superior contact stability.

Materials and Sizes of PdAgCu Probes needles pins

Excellent Electrical Conductivity: Our PdAgCu probes exhibit a low and stable electrical resistivity (as low as 14 μΩ·cm after treatment). This ensures a clear, low-noise signal path, which is essential for accurate parametric measurements and high-frequency testing of complex SoCs, AI chips, and 5G devices.

Outstanding Wear and Corrosion Resistance: The noble metal content provides inherent resistance to oxidation and corrosion, guaranteeing stable contact resistance over millions of touchdowns. This reliability is the backbone of high-yield test programs, reducing the need for frequent and costly probe changes.

Consistent and Stable Performance: The alloy's thermal stability ensures that its mechanical and electrical properties remain consistent across a wide temperature range, making it ideal for both wafer sort (CP) and final test (FT) environments.

In the high-stakes world of semiconductor manufacturing, you need a partner you can trust. We are that partner. By choosing our PdAgCu probes, you are investing in superior performance, enhanced reliability, and long-term value. We are dedicated to pushing the boundaries of precision engineering to help you achieve higher yields and bring your most advanced products to market with confidence. Contact us to discover how our PdAgCu probe solutions can elevate your testing processes to a new level of precision and performance.